The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Nov. 10, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Og Soon Kim, Suwon-si, KR;

Chae Dong Lee, Suwon-si, KR;

Hye Won Kim, Suwon-si, KR;

Jung Won Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/008 (2006.01); B32B 5/16 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); B32B 5/16 (2013.01); B32B 27/08 (2013.01); B32B 27/302 (2013.01); B32B 27/38 (2013.01); H01G 4/30 (2013.01); B32B 2264/105 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2457/16 (2013.01);
Abstract

A multilayer electronic component includes: a body and an external electrode disposed on the body, wherein the external electrode includes a conductive resin layer containing a bisphenol A-based resin and a biphenyl-based resin with a specific mixing ratio (e.g., a ratio of a content of the biphenyl-based resin with respect to a total content is 10 wt % or more and 50 wt % or less). Such a resin mixing ratio between the bisphenol A-based resin and the biphenyl-based resin can lead to 0.337≤2*C/A≤0.367 or 0.048≤B/A≤0.14, with an aromatic ring peak intensity (A), a carbonyl peak intensity (B), and an alcohol peak intensity (C) in a Fourier transform infrared spectroscopy (FT-IR) analysis. The multilayer electronic component showing such peak intensity characteristics can suppress oxidation of a conductive resin layer while also securing excellent adhesive strength of the conductive resin layer.


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