The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Jan. 15, 2021
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Mitsubishi Heavy Industries Aero Engines, Ltd., Aichi, JP;
National University Corporation Tokai National Higher Education and Research System, Aichi, JP;
Yukio Naiki, Tokyo, JP;
Shiro Nagami, Tokyo, JP;
Keigo Matsunaga, Tokyo, JP;
Koji Mizutani, Tokyo, JP;
Eiji Shamoto, Aichi, JP;
Takehiro Hayasaka, Aichi, JP;
Shota Yoshino, Aichi, JP;
Abstract
A low toughness workpiece cutting apparatus, a low toughness workpiece manufacturing method and a low toughness workpiece manufacturing program for predicting an occurrence of defect and/or non-occurrence of defect before a cutting process of low toughness material. A defect prediction device is provided with a storage device, a processor and an interface. The storage device stores tool data that represent physical characteristics and a shape of a tool, cutting data that represent a group of parameters of a cutting process to be performed to a workpiece by use of the tool and material data that represent physical characteristics and a shape of the workpiece. The processor performs an analysis of deformation of the workpiece due to a cutting force and an analysis of fracture due to the deformation, and performs a prediction of an occurrence of defect and/or a non-occurrence of defect of the workpiece due to the cutting process.