The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Sep. 22, 2023
Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;
Guangchao Du, Shandong, CN;
Yongzheng Tang, Shandong, CN;
Tao Wu, Shandong, CN;
Jianwei Mu, Shandong, CN;
Shaoshuai Sui, Shandong, CN;
Jihong Han, Shandong, CN;
Sitao Chen, Shandong, CN;
Qian Shao, Shandong, CN;
Bangyu Yu, Shandong, CN;
Benzheng Dong, Shandong, CN;
Xiangxun Sun, Shandong, CN;
Fabu Xu, Shandong, CN;
HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Qingdao, CN;
Abstract
An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The laser assembly and the silicon optical chip are located on the base. The laser assembly includes an upper box, conductive substrates, laser chips and a light transmitting member. The upper box and the base are combined to provide a cavity. The cavity has an opening and a slot. The laser chips are located on the conductive substrates which are at least partially located in the cavity. The light transmitting member is disposed between the upper box and the base, and is configured to enclose the opening. Light exit surfaces of the laser chips are parallel to a light incident surface of the light transmitting member, and the light incident surface and a light exit surface of the light transmitting member are not parallel.