The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Jul. 19, 2022
Applicant:

The Royal Institution for the Advancement of Learning/mcgill University, Montréal, CA;

Inventor:

Changhong Cao, Montreal, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 3/08 (2006.01); G01N 3/06 (2006.01);
U.S. Cl.
CPC ...
G01N 3/08 (2013.01); G01N 3/066 (2013.01); G01N 2203/0019 (2013.01); G01N 2203/0057 (2013.01); G01N 2203/0286 (2013.01); G01N 2203/0623 (2013.01);
Abstract

There is described a system for characterizing a physical property of a sample. The system generally has a microelectromechanical system (MEMS) device having a framework, a shuttle member extending along a longitudinal orientation within the framework, a shuttle actuator having obliquely extending arms extending between the framework and the shuttle member, the shuttle actuator configured for expanding the arms upon application of electricity thereacross, said expanding applying a force onto the shuttle member and moving the shuttle member at least partly in the longitudinal orientation, and a socket positioned adjacent a tip of the shuttle member; and a MEMS chip receiving the sample and being configured for insertion into the socket, whereby, when the MEMS chip is received in the socket and loaded with the sample, the force applied onto the shuttle member is transferred into stress internal to the MEMS chip via the tip of the shuttle member.


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