The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

May. 22, 2024
Applicant:

Wuhan University, Hubei, CN;

Inventors:

Fang Dong, Wuhan, CN;

Sheng Liu, Wuhan, CN;

Cheng Lei, Wuhan, CN;

Yueyun Weng, Wuhan, CN;

Assignee:

Wuhan University, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 23/00 (2006.01); C30B 23/06 (2006.01); G02B 17/08 (2006.01);
U.S. Cl.
CPC ...
C30B 23/002 (2013.01); C30B 23/063 (2013.01); G02B 17/08 (2013.01);
Abstract

Provided herein is a laser processing system integrated with an MBE device, including an MBE growth chamber, a sample table, an optical path mechanism, a heat insulation mechanism, and a cooling mechanism. An opening is formed in a side of the MBE growth chamber. The sample table is fixed in the MBE growth chamber, corresponds to a position of the opening, and is used for placing a substrate sample material. The optical path mechanism is relatively arranged on a side of the MBE growth chamber, and the optical path mechanism is provided with a light-emitting end. A side of the light-emitting end penetrates through the opening of the MBE growth chamber, extends into the MBE growth chamber, and is spaced apart from the sample table. The optical path mechanism is sealedly connected to the opening of the MBE growth chamber. By integrating the optical path mechanism within the MBE device and utilizing direct laser writing, the system facilitates close-range processing of the sample, enhancing the laser's focusing capability and effectively ensuring the precision and quality of laser processing.


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