The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Oct. 14, 2021
Applicant:
Ajinomoto Co., Inc., Tokyo, JP;
Inventor:
Kenji Kawai, Kawasaki, JP;
Assignee:
AJINOMOTO CO., INC., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09D 163/00 (2006.01); C08G 73/10 (2006.01); C08L 63/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 73/1007 (2013.01); C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08G 73/1071 (2013.01); C08G 73/1082 (2013.01); C08L 63/00 (2013.01); C08L 2203/20 (2013.01); H05K 1/0346 (2013.01);
Abstract
Resin composition including an epoxy resin, an epoxy resin curing agent, and a polyimide resin including a specified structural unit provide a high yield after patterning.
Quick Actions:
Kawai, Kenji. (2025). Resin composition, cured product, sheet lamination material, resin sheet, printed wiring board, and semiconductor device, and method for producing printed wiring board (U.S. Patent No. 12195636). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12195636
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile