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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12195566 B1

PDFFull Text
Date of Patent:
Jan. 14, 2025

Filed:

Jun. 26, 2020

Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Takahito Sekido, Tokyo, JP;

Masashi Okaniwa, Tokyo, JP;

Genki Sugiyama, Tokyo, JP;

Kentaro Takano, Tokyo, JP;

Tsuyoshi Kida, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Robert C Boyle

Int. Cl.
CPC ...
C08F 222/40 (2006.01); C08F 2/44 (2006.01); C08F 212/14 (2006.01); C08J 5/18 (2006.01); H01L 21/683 (2006.01); H01L 23/18 (2006.01);
U.S. Cl.
CPC ...
C08F 222/40 (2013.01); C08F 2/44 (2013.01); C08F 212/24 (2020.02); C08J 5/18 (2013.01); H01L 21/6836 (2013.01); H01L 23/18 (2013.01);
Abstract

A film containing: a propenyl group-containing resin (A) including, at an end of a molecule, a constituent unit represented by the following formula (1); a radical polymerizable resin or compound (B) other than the propenyl group-containing resin (A); and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) includes at least one selected from the group consisting of a maleimide group and a citraconimide group. In the formula (1), —* represents a bonding hand.

Find Patent Forward Citations

Sekido, Takahito. (2025). Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device (U.S. Patent No. 12195566). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12195566

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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