Fabrication of mems device with automated dispensing of damping fluid and viscosity control

Abstract

A microelectromechanical system (MEMS) device comprising a wafer including a MEMS device in a substrate of the wafer is mounted to a fluid dispenser stage. The MEMS device has a damping structure coupled to a suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to the fixed part of the substrate. The damping structure extends into a gap between the suspended element and fixed part of the substrate. The fluid confinement structures permit movement of the damping structure within a limited portion of the gap and confine a viscoelastic fluid to the limited portion of the gap. A viscoelastic fluid is deposited onto the wafer in an area of the wafer configured to communicate the viscoelastic fluid into the limited portion of the gap.