The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Jan. 20, 2022
Applicant:

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Cheng-Han Wang, Taipei, TW;

Cheng-Hong Su, Taipei, TW;

Chih-Li Yu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/13 (2006.01); B60Q 1/26 (2006.01); B60Q 1/30 (2006.01); B60Q 1/44 (2006.01); F21S 43/14 (2018.01); F21S 43/20 (2018.01); F21V 9/30 (2018.01); H01L 33/10 (2010.01); H01L 33/38 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
B60Q 1/30 (2013.01); B60Q 1/2607 (2013.01); B60Q 1/44 (2013.01); F21S 43/14 (2018.01); F21S 43/255 (2018.01); F21V 9/30 (2018.02); H01L 25/13 (2013.01); H01L 33/10 (2013.01); H01L 33/382 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); F21Y 2115/10 (2016.08);
Abstract

A light-emitting device is provided. The light-emitting device includes a light-emitting diode, a reflective structure, and a package structure. The reflective structure includes a bottom surface and a lateral part. The light-emitting diode is disposed on the bottom surface. The lateral part is disposed surrounding the bottom surface and disposed on the bottom surface. The package structure is configured to package the light-emitting diode and the reflective structure. The package structure includes a first package part and a second package part. The first package part has a phosphorescent powder. An interface is between the first package part and the second package part. The interface is disposed below a top surface of the lateral part.


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