The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Nov. 19, 2020
Applicant:
Fujitsu Limited, Kawasaki, JP;
Inventors:
Shinichi Hirose, Yokohama, JP;
Daiyu Kondo, Atsugi, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 7/06 (2019.01); B32B 3/08 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 7/06 (2013.01); B32B 3/085 (2013.01); B32B 2262/106 (2013.01); B32B 2307/302 (2013.01); B32B 2307/732 (2013.01);
Abstract
A heat dissipation sheet includes a carbon material layer configured to include a plurality of linear carbon materials arranged in parallel with each other, an adhesive resin layer configured to include a first surface to be in contact with an end of each of the plurality of linear carbon materials, a thickness of the adhesive resin layer being less than 1 μm, and a release sheet configured to be in contact with a second surface among a plurality of surfaces of the adhesive resin layer, the second surface being over a side opposite to the first surface.