The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Jul. 22, 2021
Applicant:

Ihi Corporation, Tokyo, JP;

Inventors:

Koutarou Inose, Tokyo, JP;

Naoyuki Matsumoto, Tokyo, JP;

Shota Nakanishi, Tokyo, JP;

Daiki Okita, Tokyo, JP;

Junko Yamada, Tokyo, JP;

Assignee:

IHI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/34 (2014.01); B23K 26/354 (2014.01);
U.S. Cl.
CPC ...
B23K 26/34 (2013.01); B23K 26/354 (2015.10);
Abstract

Provided is a crack repair method of melting and eliminating a crack generated in a steel material, the method including holding a tab plate in surface contact with the steel material in which the crack is generated, thereafter continuously irradiating the tab plate to a first end portion of the crack in the steel material with a laser beam, and subsequently continuously irradiating the crack with the laser beam along the crack to a second end portion of the crack to melt and eliminate the crack. Consequently, when eliminating the crack generated in a constituent member of an existing structure or a constituent member such as a machine component, the crack can be eliminated without forming a through hole in the constituent member.


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