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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12194464 B1

PDFFull Text
Date of Patent:
Jan. 14, 2025

Filed:

Apr. 04, 2022

Integrated microfluidic system and method of fabrication

Applicant:

Corporation for National Research Initiatives, Reston, VA (US);

Inventor:

Michael A. Huff, Oakton, VA (US);

Assignee:

Corporation for National Research Initiatives, Reston, VA (US);

Attorney:

Nixon & Vanderhye, P.C.

Primary Examiner:

Jennifer Wecker

Assistant Examiner:

Oyeleye Alexander Alabi

Int. Cl.
CPC ...
B01L 3/00 (2006.01); B01F 23/00 (2022.01); B01F 23/41 (2022.01); B01F 101/23 (2022.01); B23Q 17/24 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); B81C 3/00 (2006.01); C07K 14/705 (2006.01); C12M 1/34 (2006.01); C12Q 1/04 (2006.01); C12Q 1/18 (2006.01); C12Q 1/686 (2018.01); G01N 21/3577 (2014.01); G01N 21/359 (2014.01); G01N 21/39 (2006.01); G01N 21/45 (2006.01); G01N 21/64 (2006.01); G01N 27/414 (2006.01); G01N 30/12 (2006.01); G01N 30/68 (2006.01); G01N 30/70 (2006.01); G01N 30/72 (2006.01); G01N 30/88 (2006.01); G01N 33/00 (2006.01); G01N 33/18 (2006.01); G01N 33/50 (2006.01); G01N 33/53 (2006.01); G01N 33/543 (2006.01); G01N 33/68 (2006.01); G01N 33/74 (2006.01); G02F 1/1335 (2006.01); H10K 10/46 (2023.01); H10K 85/00 (2023.01); H10K 85/20 (2023.01);
U.S. Cl.
CPC ...
B01L 3/502715 (2013.01); B01L 3/502738 (2013.01); B81B 7/02 (2013.01); B81C 1/00849 (2013.01); B81C 3/001 (2013.01); G02F 1/133516 (2013.01); B01L 2300/0663 (2013.01); B01L 2400/0439 (2013.01); B01L 2400/0622 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/05 (2013.01); B81B 2201/054 (2013.01);
Abstract

An integrated microfluidic systems and the method of fabrication is disclosed wherein various microfluidic devices fabricated onto substrates are bonded together either using an intermediary layer or not to facilitate the bonding process. The microfluidic ports on the microfluidic devices are aligned prior to bonding and the bonding results in leak-proof seals between the devices. Moreover, the fluidic capacitance using the present invention is eliminated thereby enabling microfluidic systems with far faster time responses. The example embodiments have a wide range of applications including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of multiple microfluidic devices.

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