The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Apr. 13, 2022
Western Digital Technologies, Inc., San Jose, CA (US);
Songtao Lu, Shanghai, CN;
Hsiang Ju Huang, Taichung, TW;
Binbin Zheng, Shanghai, CN;
Cheng-Hsiung Yang, Taiwan, TW;
Chien-Te Chen, Taichung, TW;
Sandisk Technologies, Inc., Milpitas, CA (US);
Abstract
In one example, the present application describes a Printed Circuit Board (PCB) that mitigates galvanic corrosion during an Organic Solderability Preservative (OSP) process used during fabrication of the PCB. The PCB includes a first metal pattern and a second metal pattern electrically coupled to each other, where the first and second metal patterns are different metals. The first metal pattern has a first area that is exposed by a solder mask layer, and the second metal pattern has a second area that is exposed by the solder mask area. A ratio of the first area to the second area is less than a threshold ratio to mitigate the galvanic corrosion of the second metal pattern exposed on the PCB during the OSP process.