The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Mar. 09, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jung Hyun Cho, Suwon-si, KR;
Jin Won Lee, Suwon-si, KR;
Byung Kuk Kang, Suwon-si, KR;
Chang Soo Woo, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/30 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 27/306 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01);
Abstract
A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate.