The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Nov. 07, 2021
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Ventsislav Yantchev, Sofia, BG;

Bryant Garcia, Mississauga, CA;

Viktor Plesski, Gorgier, CH;

Soumya Yandrapalli, Lausanne, CH;

Robert B. Hammond, Santa Barbara, CA (US);

Patrick Turner, San Bruno, CA (US);

Jesson John, Dublin, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/02 (2006.01); H03H 3/08 (2006.01); H03H 9/13 (2006.01); H03H 9/145 (2006.01); H03H 9/17 (2006.01); H03H 9/25 (2006.01); H03H 9/56 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02228 (2013.01); H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/02031 (2013.01); H03H 9/02637 (2013.01); H03H 9/132 (2013.01); H03H 9/145 (2013.01); H03H 9/175 (2013.01); H03H 9/176 (2013.01); H03H 9/25 (2013.01); H03H 9/562 (2013.01); H03H 9/564 (2013.01); H03H 9/568 (2013.01); H03H 2003/025 (2013.01);
Abstract

Methods of fabricating resonator and filter devices. A first conductor pattern formed on a front surface of a piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. An acoustic Bragg reflector is between a substrate and a back surface of the piezoelectric plate, the acoustic Bragg reflector configured to reflect the shear primary acoustic mode. A second conductor pattern including a second plurality of contact pads is formed on a back surface of the interposer. The first plurality of contact pads is directly connected to respective contact pads of the second plurality of contact pads. A perimeter of the acoustic resonator chip is sealed to a perimeter of the interposer.


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