The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Mar. 08, 2021
Applicant:

Lumentum Operations Llc, San Jose, CA (US);

Inventors:

Richard F. Carson, Albuquerque, NM (US);

Nein-Yi Li, Albuquerque, NM (US);

Mial E. Warren, Albuquerque, NM (US);

Assignee:

Lumentum Operations LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/42 (2006.01); H01S 5/0237 (2021.01); H01S 5/024 (2006.01); H01S 5/042 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
H01S 5/423 (2013.01); H01S 5/0237 (2021.01); H01S 5/02469 (2013.01); H01S 5/042 (2013.01); H01S 5/18305 (2013.01); H01S 5/18327 (2013.01); H01S 5/18341 (2013.01); H01S 5/18344 (2013.01);
Abstract

A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.


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