The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Mar. 31, 2022
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Shipei Li, Beijing, CN;

Wusheng Li, Beijing, CN;

Ying Zhao, Beijing, CN;

Huili Wu, Beijing, CN;

Sheng Xu, Beijing, CN;

Wei He, Beijing, CN;

Renquan Gu, Beijing, CN;

Wenqing Xue, Beijing, CN;

Jianjun Zhao, Beijing, CN;

Qi Yao, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); G02F 1/133603 (2013.01); G02F 1/133608 (2013.01); G02F 1/133612 (2021.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); G02F 2203/02 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light-emitting substrate includes a transparent substrate; a first metal light-shielding layer, a wiring layer and light-emitting devices. The first metal light-shielding layer is disposed on the transparent substrate. The wiring layer is disposed on a side of the first metal light-shielding layer away from the transparent substrate, and the wiring layer includes circuit traces and pads. Orthographic projections of the circuit traces and the pads on the transparent substrate are all located within an orthographic projection of the first metal light-shielding layer on the transparent substrate. The light-emitting devices are disposed on a side of the wiring layer away from the transparent substrate, and electrically connected to some of the pads; and orthographic projections of the light-emitting devices on the transparent substrate are located within the orthographic projection of the first metal light-shielding layer on the transparent substrate.


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