The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Oct. 24, 2019
Applicant:

Sciosense B.v., AE Eindhoven, NL;

Inventors:

Alessandro Faes, Premstätten, AT;

Jörg Siegert, Graz, AT;

Willem Frederik Adrianus Besling, JN Eindhoven, NL;

Remco Henricus Wilhelmus Pijnenburg, AE Hoogeloon, NL;

Assignee:

Sciosense B.V., AE Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 21/306 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 29/84 (2013.01); H01L 21/30625 (2013.01); H01L 21/76843 (2013.01);
Abstract

In an embodiment a method includes providing a semiconductor body, forming a sacrificial layer above a surface of the semiconductor body, applying a diaphragm on the sacrificial layer and removing the sacrificial layer by introducing an etchant into openings of the diaphragm, wherein applying the diaphragm comprises applying a first layer, reducing a roughness of a surface of the first layer facing away from the semiconductor body thereby providing a processed surface, and patterning and structuring the first layer to form the openings.


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