The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Feb. 27, 2020
Hefei Boe Joint Technology Co., Ltd., Hefei, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Yongqian Li, Beijing, CN;
Can Yuan, Beijing, CN;
Meng Li, Beijing, CN;
Xuehuan Feng, Beijing, CN;
Zhongyuan Wu, Beijing, CN;
Zhidong Yuan, Beijing, CN;
HEFEI BOE JOINT TECHNOLOGY CO., LTD., Hefei, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
The present disclosure provides a motherboard and a manufacturing method for the motherboard, the motherboard includes at least one display area, a periphery area surrounding the at least one display area, a plurality of test terminals, an electrostatic discharge line, a plurality of resistors and at least one thin film transistor. The plurality of test terminals are respectively electrically connected to the electrostatic discharge line through the plurality of resistors. At least one of the plurality of resistors includes an inorganic nonmetal trace. The at least one thin film transistor includes an active layer, and the inorganic nonmetal trace includes a same semiconductor matrix material as the active layer of the at least one thin film transistor.