The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Mar. 16, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Masahiro Totsuka, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An adhesive layer () in which the same number of first and second layers () having conductivity are alternately laminated in order on a semiconductor substrate (). A metal layer () is formed on the adhesive layer (). The first layer () is composed of a material containing an element composing the semiconductor substrate (). The second layer () has higher adhesion to the metal layer () than the first layer (). The adhesive layer () has four or more layers including the first and second layers (). Among the first layers () and the second layers () constituting the adhesive layer (), excluding the second layer () contacting the metal layer (), the first layer () contacting the semiconductor substrate () has the largest film thickness, and excluding the first layer () contacting the semiconductor substrate (), the second layer () contacting the metal layer () has the largest film thickness.