The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Nov. 17, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Su Ji Kang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 4/005 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 4/005 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component includes a body including a plurality of dielectric layers, a side margin portion disposed on the body, and external electrodes disposed on the body. The body includes an active portion having internal electrodes alternately arranged with the dielectric layer interposed therebetween in the first direction and a cover portion disposed on both end surfaces of the active portion in a first direction, the active portion. The cover portion, and the side margin portion include molybdenum (Mo). A Mo content in an interfacial portion, a region of the active portion, adjacent to one of the cover portion or the side margin portion, is higher than a Mo content in a central portion of the active portion. A Mo content in the one of the cover portion and the side margin portion is higher than the Mo content in the interfacial portion.


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