The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Mar. 15, 2022
Applicant:

Yageo Corporation, Kaohsiung, TW;

Inventors:

Shen-Li Hsiao, Kaohsiung, TW;

Chih-Wei Chi, Kaohsiung, TW;

Assignee:

YAGEO CORPORATION, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B41M 3/00 (2006.01); C23C 14/34 (2006.01); H01C 17/065 (2006.01); H01C 17/28 (2006.01);
U.S. Cl.
CPC ...
H01C 17/065 (2013.01); B41M 3/006 (2013.01); C23C 14/34 (2013.01); H01C 17/281 (2013.01);
Abstract

A method for fabricating a micro resistance layer and a method for fabricating a micro resistor are provided. The method for fabricating a micro resistance layer includes: providing a substrate; forming a first resistance layer on the substrate by using a screen printing process or a sputtering process; dividing the first resistance layer into second resistance layers, wherein each one of the product regions includes a second resistance layer, and an area of each one of the product regions is smaller than 0.4*0.2 mm; and trimming the second resistance layer of each one of the product regions according to a predetermined resistance value to enable the pattern of each one of the second resistance layers to correspond to the predetermined resistance value. The method for fabricating a micro resistor uses the method for fabricating a micro resistance layer for fabrication of the micro resistor.


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