The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Mar. 09, 2023
Applicant:
Cypress Semiconductor Corporation, San Jose, CA (US);
Inventors:
Oleksandr Hoshtanar, Lviv, UA;
Igor Kravets, Lviv, UA;
Oleksandr Karpin, Lviv, UA;
Bo Chang, Cupertino, CA (US);
Assignee:
Cypress Semiconductor Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); G02F 1/133 (2006.01);
U.S. Cl.
CPC ...
G06V 40/1306 (2022.01); G02F 1/13312 (2021.01);
Abstract
A sensor package includes at least one die, a fingerprint sensor, a mold material, and a land grid array. The fingerprint sensor is electrically coupled to the at least one die. The mold material encapsulates the at least one die. The land grid array layer is electrically coupled to the at least one die. The land grid array layer, the fingerprint sensor, and the mold material each include a common footprint.