The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Apr. 20, 2022
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Bharath Ramakrishnan, Bellevue, WA (US);

Husam Atallah Alissa, Redmond, WA (US);

Eric C. Peterson, Woodinville, WA (US);

Christian L. Belady, Mercer Island, WA (US);

Dennis Trieu, Calgary, CA;

Ioannis Manousakis, Redmond, WA (US);

Nicholas Andrew Keehn, Kirkland, WA (US);

Kathryn M. Oseen-Senda, Seattle, WA (US);

Douglas Patrick Kelley, Sammamish, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); H05K 7/203 (2013.01); H05K 7/20327 (2013.01); H05K 7/20336 (2013.01); H05K 7/20381 (2013.01);
Abstract

A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.


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