The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Nov. 27, 2020
Applicant:

Glowforge Inc., Seattle, WA (US);

Inventors:

Daniel Shapiro, Mercer Island, WA (US);

Mark Gosselin, Seattle, WA (US);

Nicodemus Paradiso, Seattle, WA (US);

Penelope Ackerman, Seattle, WA (US);

Rachael Ludwick, Seattle, WA (US);

Will Simons, Seattle, WA (US);

John Peter Tapsell, Tokyo, JP;

Assignee:

Glowforge, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 19/4099 (2006.01); G05B 13/04 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); G05B 13/041 (2013.01); G05B 19/41885 (2013.01); G05B 2219/41354 (2013.01); G05B 2219/49023 (2013.01);
Abstract

A method for computer numerically controlled processing may include receiving configurations for a fabrication in which a computer numerically controlled machine processes a material to achieve one or more designs. An analysis may be performed to determine whether a thermal event occurs during the fabrication. The analysis may include performing one or more of a time-variant simulation and a time-invariant simulation of the fabrication. The thermal event may include one or more regions of the material exhibiting an undesirable response to the electromagnetic energy delivered to the material. One or more outputs may be generated based on the result of the thermal verification. The outputs may include a visualization of the quantity of energy exposure across the material, an alert if a thermal event is determined to occur during the fabrication, and corrective actions for resolving potential thermal events.


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