The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
May. 14, 2021
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventor:
Takahiro Okawara, Haibara-gun, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/027 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01); C09D 7/40 (2018.01); C09D 7/65 (2018.01); C09D 183/02 (2006.01); G03F 7/004 (2006.01); G03F 7/028 (2006.01); G03F 7/075 (2006.01); C01B 33/14 (2006.01);
U.S. Cl.
CPC ...
G03F 7/027 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01); C09D 7/67 (2018.01); C09D 7/68 (2018.01); C09D 183/02 (2013.01); G03F 7/0048 (2013.01); G03F 7/028 (2013.01); G03F 7/0757 (2013.01); C01B 33/14 (2013.01);
Abstract
Provided is a composition including colloidal silica particles; and a solvent, in which a viscosity at 25° C. is 4 mPa·s or lower. The colloidal silica particles are a composition in which a plurality of spherical silica particles are linked in a beaded shape or a composition in which a plurality of spherical silica particles are linked in a planar shape. The solvent includes a solvent A1 having a boiling point of 190° C. to 280° C. Provided is also a film forming method using the above-described composition.