The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Nov. 29, 2022
Applicant:

E Ink Corporation, Billerica, MA (US);

Inventor:

Nishit Murari, Billerica, MA (US);

Assignee:

E Ink Corporation, Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1676 (2019.01); C08J 3/075 (2006.01); C08J 3/24 (2006.01); C08K 3/04 (2006.01); C08K 3/16 (2006.01); C08K 3/22 (2006.01); G02F 1/13 (2006.01); G02F 1/1343 (2006.01); G02F 1/167 (2019.01); G02F 1/16757 (2019.01); H01B 1/04 (2006.01); H01B 1/12 (2006.01); H01L 27/142 (2014.01); H01L 31/0392 (2006.01); H10K 59/88 (2023.01); H10K 71/00 (2023.01); H10K 77/10 (2023.01); H01L 31/0224 (2006.01); H10K 85/10 (2023.01); H10K 85/20 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
G02F 1/1676 (2019.01); C08J 3/075 (2013.01); C08J 3/24 (2013.01); C08K 3/04 (2013.01); C08K 3/16 (2013.01); C08K 3/22 (2013.01); G02F 1/1306 (2013.01); G02F 1/13439 (2013.01); G02F 1/167 (2013.01); G02F 1/16757 (2019.01); H01B 1/04 (2013.01); H01B 1/124 (2013.01); H01L 27/142 (2013.01); H01L 31/03926 (2013.01); H10K 59/88 (2023.02); H10K 71/861 (2023.02); H10K 77/111 (2023.02); B32B 2457/20 (2013.01); C08J 2305/04 (2013.01); C08J 2329/04 (2013.01); C08K 2003/162 (2013.01); C08K 2003/2237 (2013.01); C08K 2003/2244 (2013.01); C08K 2201/001 (2013.01); C08K 2201/014 (2013.01); H01L 31/022425 (2013.01); H10K 85/10 (2023.02); H10K 85/221 (2023.02); H10K 2102/311 (2023.02);
Abstract

A multi-laver device and its method of manufacture are disclosed. The multi-layer device comprises a first electrode layer, a first repair layer, a functional layer, and a second electrode layer. The first repair layer comprises a conductive hydrogel film or conductive hydrogel beads, the conductive hydrogel film or the conductive hydrogel beads comprising conductive filler particles dispersed in a cross-linked polymer. The repair layer protects the multi-layer device from electrical short circuits. A multilayer device is also disclosed including a light-transmissive electrode layer comprising a porous mesh or porous spheres.


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