The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

May. 13, 2022
Applicant:

Rockley Photonics Limited, Altrincham, GB;

Inventors:

Mohammadsadegh Faraji-Dana, Pasadena, CA (US);

Farzaneh Afshinmanesh, Pasadena, CA (US);

Iain Anteney, Newport, GB;

Jeffrey Driscoll, San Jose, CA (US);

Alexander Gondarenko, San Jose, CA (US);

Dhiraj Kumar, Redondo Beach, CA (US);

Abu Thomas, Oak Park, CA (US);

Andrea Trita, Pasadena, CA (US);

Aaron John Zilkie, Pasadena, CA (US);

Assignee:

Rockley Photonics Limited, Altrincham, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/26 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4214 (2013.01); G02B 2006/12097 (2013.01); G02B 2006/12104 (2013.01); G02B 6/262 (2013.01);
Abstract

An optical out-coupler unit for out-coupling light from a waveguide, comprising a substrate having a planar top surface, a waveguide arranged on the top surface of the substrate and having a facet, a reflective surface, wherein the reflective surface is arranged spaced apart from the facet and opposing the facet, wherein the reflective surface is inclined with respect to a normal to the top surface of the substrate by more than 45°. The optical out-coupler may be part of a photonic integrated chip (PIC).


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