The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Apr. 07, 2021
Applicant:

Quantum-si Incorporated, Guilford, CT (US);

Inventors:

Eric A. G. Webster, Santa Clara, CA (US);

Dajiang Yang, San Jose, CA (US);

Xin Wang, San Jose, CA (US);

Zhaoyu He, Milpitas, CA (US);

Changhoon Choi, Palo Alto, CA (US);

Peter J. Lim, Saratoga, CA (US);

Todd Rearick, Cheshire, CT (US);

Assignee:

Quantum-Si Incorporated, Branford, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G01N 21/64 (2006.01); G05F 1/46 (2006.01);
U.S. Cl.
CPC ...
G01N 21/6456 (2013.01); G01N 21/6408 (2013.01); G01N 21/6454 (2013.01); G05F 1/46 (2013.01); H01L 27/14603 (2013.01); H01L 27/14614 (2013.01); H01L 27/14616 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); G01N 2021/6439 (2013.01);
Abstract

Aspects of the present disclosure relate to techniques for reducing skew in an integrated device, such as a CMOS imaging device. In some aspects, multiple pixels of an integrated circuit may be configured to receive a same control signal and conduct charge carriers responsive to the control signal substantially at the same time. In some aspects, an integrated circuit may have modulated charge transfer channel voltage thresholds, such as by having different charge transfer channel lengths, and/or a doped portion configured to set a voltage threshold for charge transfer. In some aspects, an integrated circuit may have a via structure having a plurality of vias extending between continuous portions of at least two metal layers. In some aspects, an integrated circuit may include a row of pixels and a voltage source configured to provide a voltage to bias a semiconductor substrate of the integrated circuit along the row of pixels.


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