The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Oct. 14, 2020
Applicant:

Valeo Vision, Bobigny, FR;

Inventors:

Alexandre Val, Bobigny, FR;

Amine Alili, Bobigny, FR;

Samya Belkessam, Bobigny, FR;

Assignee:

Valeo Vision, Bobigny, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21S 45/47 (2018.01); F21S 41/141 (2018.01); F21S 41/19 (2018.01); F21V 29/70 (2015.01); F21V 29/89 (2015.01); F21Y 115/10 (2016.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
F21S 45/47 (2018.01); F21S 41/141 (2018.01); F21S 41/192 (2018.01); F21V 29/70 (2015.01); F21V 29/89 (2015.01); H01L 33/644 (2013.01); F21Y 2115/10 (2016.08);
Abstract

The invention relates to an assembly of light sources including an integrated circuit with a connection pad, a light-emitting part with micro-LEDs and an active surface, a fan-out encapsulation surrounding at least a part of the integrated circuit, a first multilayer metal layer, a second metal layer that includes contact parts being in direct contact with a rear face of the integrated circuit, a heat sink, a matrix fixation layer arranged between the second metal layer and the heat sink and a printed circuit board. The first metal layer is arranged so as to cover at least a part of the front face of the integrated circuit, providing an electrical connection between the pad of the integrated circuit and a pad of the assembly.


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