The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Apr. 20, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Petteri Kilpinen, Espoo, FI;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00063 (2013.01); B81C 1/00412 (2013.01); B81C 2201/013 (2013.01); B81C 2201/053 (2013.01);
Abstract

A method for manufacturing a micromechanical structure in the structural layer of a wafer by forming a first gap and a second gap depositing and patterning a first etching mask and a second etching mask on a horizontal face of the structural layer, etching trenches through the structural layer in the first and second unprotected areas which are not protected by the first etching mask or the second etching mask, coating at least the sidewalls of the trenches with a protective layer and removing the second etching mask at least from a second opening in the first etching mask, so that a temporarily protected area is exposed, and etching away the structural layer in the exposed temporarily protected area.


Find Patent Forward Citations

Kilpinen, Petteri. (2025). Method for etching gaps of unequal width (U.S. Patent No. 12187605). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12187605

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…