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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12187601 B1

PDFFull Text
Date of Patent:
Jan. 07, 2025

Filed:

Jan. 14, 2019

Electronic sensors with sensor die in package structure cavity

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Barry Jon Male, West Granby, CT (US);

Benjamin Cook, Addison, TX (US);

Robert Alan Neidorff, Bedford, NH (US);

Steve Kummerl, Carrollton, TX (US);

Assignee:

Texas Instruments Incorporated, Dallas, TX (US);

Attorneys:

John R. Pessetto

Frank D. Cimino

Primary Examiner:

Mary A Wilczewski

Assistant Examiner:

Tsz K Chiu

Int. Cl.
CPC ...
H01L 23/28 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81B 7/0061 (2013.01); B81C 1/00325 (2013.01); B81B 2201/0264 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01);
Abstract

Described examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

Find Patent Forward Citations

Male, Barry. (2025). Electronic sensors with sensor die in package structure cavity (U.S. Patent No. 12187601). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12187601

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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