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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12187021 B1

PDFFull Text
Date of Patent:
Jan. 07, 2025

Filed:

Mar. 15, 2021

Method for composite delamination

Applicant:

Grst International Limited, Hong Kong, CN;

Inventors:

Kam Piu Ho, Hong Kong, CN;

Yingkai Jiang, Shenzhen, CN;

Yangjian Dong, Mianyang, CN;

Assignee:

GRST International Limited, Hong Kong, CN;

Attorney:
Primary Examiner:

Philip C Tucker

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B32B 43/00 (2006.01); C11D 7/06 (2006.01); C11D 7/50 (2006.01); C22B 7/00 (2006.01); C22B 21/00 (2006.01); H01M 4/04 (2006.01); H01M 4/36 (2006.01); H01M 4/62 (2006.01); H01M 10/0525 (2010.01); H01M 10/54 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); C11D 7/06 (2013.01); C11D 7/5004 (2013.01); C22B 7/008 (2013.01); C22B 21/0023 (2013.01); H01M 4/0404 (2013.01); H01M 4/366 (2013.01); H01M 4/621 (2013.01); H01M 4/622 (2013.01); H01M 4/624 (2013.01); H01M 4/625 (2013.01); H01M 10/0525 (2013.01); H01M 10/54 (2013.01); B32B 2250/02 (2013.01); B32B 2305/70 (2013.01); B32B 2457/10 (2013.01); C11D 2111/16 (2024.01); H01M 2004/028 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1116 (2015.01);
Abstract

The invention provides a method for delaminating a composite by immersing the composite into a delamination solution; wherein the composite comprises a metal substrate and a coating applied on one side or both sides of the metal substrate, wherein the coating comprises a polymeric binder; and wherein the polymeric binder comprises an aqueous copolymer. The use of delamination solution comprising a weak base allows for complete delamination of the composite in a highly efficient and extremely fast manner. Furthermore, the delamination method disclosed herein circumvents complex separation processes, contamination and corrosion of the metal substrate and enables an excellent materials recovery. An application of the method for delaminating an electrode for a battery is disclosed herein.

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