The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Mar. 29, 2018
Applicant:

Jnc Corporation, Tokyo, JP;

Inventors:

Takafumi Kuninobu, Chiba, JP;

Takeshi Fujiwara, Chiba, JP;

Kento Ujiiye, Chiba, JP;

Kazuhiro Takizawa, Chiba, JP;

Assignee:

JNC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); H01L 23/373 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); H01L 23/373 (2013.01); H05K 1/0373 (2013.01);
Abstract

The present application relates to a laminate between an inorganic substance and metal, which is excellent in thermal conductivity and interlayer adhesion. The laminate of the present application has a thermally conductive first inorganic filler bonded with one end of first coupling agent; and a metal layer bonded with one end of a third coupling agent, in which the other end of the third coupling agent is bonded with the other end of the first coupling agent. The laminate has such a bond between the inorganic filler and the metal layer through an organic compound, whereby the laminate may be excellent in thermal conductivity and interlayer adhesion.


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