The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Jan. 31, 2023
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Vladek Kasperchik, Corvallis, OR (US);

David Michael Ingle, San Diego, CA (US);

Cory J. Ruud, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/14 (2021.01); B22F 1/05 (2022.01); B22F 1/10 (2022.01); B22F 3/10 (2006.01); B22F 10/10 (2021.01); B22F 10/16 (2021.01); B22F 10/32 (2021.01); B22F 10/34 (2021.01); B22F 10/50 (2021.01); B22F 12/10 (2021.01); B29C 64/165 (2017.01); B29C 64/209 (2017.01); B29C 64/295 (2017.01); B29C 64/371 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B33Y 70/10 (2020.01); C08L 13/02 (2006.01); C22C 1/04 (2023.01); B22F 1/103 (2022.01); B22F 5/08 (2006.01); B22F 12/53 (2021.01); B22F 12/63 (2021.01); C08K 5/053 (2006.01);
U.S. Cl.
CPC ...
B22F 10/14 (2021.01); B22F 1/05 (2022.01); B22F 1/10 (2022.01); B22F 3/1021 (2013.01); B22F 10/10 (2021.01); B22F 10/16 (2021.01); B22F 10/32 (2021.01); B22F 10/34 (2021.01); B22F 10/50 (2021.01); B22F 12/10 (2021.01); B29C 64/165 (2017.08); B29C 64/209 (2017.08); B29C 64/295 (2017.08); B29C 64/371 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); C08L 13/02 (2013.01); C22C 1/0425 (2013.01); B22F 1/103 (2022.01); B22F 3/10 (2013.01); B22F 3/1007 (2013.01); B22F 5/08 (2013.01); B22F 12/53 (2021.01); B22F 12/63 (2021.01); B22F 2201/013 (2013.01); B22F 2201/02 (2013.01); B22F 2201/04 (2013.01); B22F 2201/20 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C08K 5/053 (2013.01); Y02P 10/25 (2015.11);
Abstract

Described herein are compositions, methods, and systems for printing metal three-dimensional objects. In an example, described is a method of printing a three-dimensional object comprising: (i) depositing a metal powder build material, wherein the metal powder build material has an average particle size of from about 10 μm to about 250 μm; (ii) selectively applying a binder fluid on at least a portion of the metal powder build material, wherein the binder fluid comprises an aqueous liquid vehicle and latex polymer particles dispersed in the aqueous liquid vehicle; (iii) heating the selectively applied binder fluid on the metal powder build material to a temperature of from about 40° C. to about 180° C.; and (iv) repeating (i), (ii), and (iii) at least one time to form the three-dimensional object.


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