The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Dec. 04, 2019
Applicant:

Lts Lohmann Therapie-systeme Ag, Andernach, DE;

Inventors:

Michael Kulik, Urmitz, DE;

Andreas Hennig, Messstetten, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61M 37/00 (2006.01); B29C 39/02 (2006.01); B29C 39/24 (2006.01); B29C 39/26 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
A61M 37/0015 (2013.01); B29C 39/026 (2013.01); B29C 39/24 (2013.01); B29C 39/26 (2013.01); A61M 2037/0046 (2013.01); A61M 2037/0053 (2013.01); B29L 2031/7544 (2013.01);
Abstract

The present disclosure relates to a method for producing microneedle arrays in a mold, including a plurality of receptacles that taper from an upper base surface to a lower tip surface, where a first component is fed into at least two receptacles through a feed opening that is spaced apart from the base surface, where the receptacles are filled with an additional component from above the feed opening, where the fillings of at least said two receptacles, which fillings are formed of at least the first component and the additional component, are connected to one another above the base surfaces, and where after the first component and the additional component have solidified, the microneedle array comprising the fillings that have solidified to form needles is removed from the mold.


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