The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Jul. 27, 2022
Applicant:
Aisin Technical Center of America, Inc., Northville, MI (US);
Inventors:
Assignee:
Aisin Technical Center of America, Inc., Northville, MI (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); B32B 7/025 (2019.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0045 (2013.01); B32B 7/025 (2019.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/32 (2013.01); H05K 9/0079 (2013.01); H05K 9/0083 (2013.01); B32B 2250/02 (2013.01); B32B 2250/242 (2013.01); B32B 2307/212 (2013.01); B32B 2457/00 (2013.01);
Abstract
An electronic component housing defining an EMI shield and an ESD protection cover includes a polymeric core formed from a first polymeric material with a reinforcement material and an overmolded outer layer formed from a second polymeric material with between about 2 wt. % and about 30 wt. % graphene. The reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof, the overmolded outer layer defines a housing skin disposed on the polymeric core.