The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Aug. 28, 2020
Applicant:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, 's-Gravenhage, NL;

Inventors:

Jeroen Van Den Brand, Goirle, NL;

Stephan Harkema, Hilversum, NL;

Margaretha Maria De Kok, Eindhoven, NL;

Adri Van Der Waal, Zaltbommel, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H05K 1/0274 (2013.01); H05K 1/0284 (2013.01); H05K 3/0014 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

An electronic device () comprises an electronics substrate () with at least one light emitting device (), a cover substrate () with a graphical pattern including at least one window (), and a thermoplastic layer () there between. A multilayer laminate () of the device () is formed by combining the electronics substrate () and the cover substrate () by lamination with protruding electronic components () facing the thermoplastic layer (). At least the thermoplastic layer () is heated to a lamination temperature (T) for increasing a plasticity of the thermoplastic material (). The electronic components () are pushed by the lamination into the heated thermoplastic layer () for embedding the electronic components () in the thermoplastic material ().


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