The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Sep. 23, 2022
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Eijiro Iwase, Minamiashigara, JP;

Kenji Ichikawa, Minamiashigara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1208 (2013.01); H05K 2203/0143 (2013.01);
Abstract

A metal pattern forming method has: producing a first base having a pattern of lyophilic portions which have lyophilic properties with respect to a liquid containing a metal component and liquid-repellent portions which have liquid-repellent properties with respect to the liquid containing a metal component; producing a second base which holds the liquid containing a metal component; and transferring the liquid containing a metal component from the second base to the lyophilic portions of the first base by bringing the first base and the second base into contact with each other. With the metal pattern forming method, it is possible to form a metal pattern with high accuracy in which the metal is prevented from adhering to an unnecessary position on the base.


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