The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Jan. 28, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Youngsun Lee, Suwon-si, KR;

Eunseok Hong, Suwon-si, KR;

Byeongkeol Kim, Suwon-si, KR;

Jongmin Jeon, Suwon-si, KR;

Donggon Jang, Suwon-si, KR;

Kisoo Jung, Suwon-si, KR;

Seounghyun Hong, Suwon-si, KR;

Hyunsung Hwang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 1/24 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H01Q 1/243 (2013.01); H05K 1/0278 (2013.01); H05K 1/115 (2013.01); H05K 1/147 (2013.01); H05K 1/185 (2013.01); H05K 1/188 (2013.01); H05K 1/189 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01);
Abstract

An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.


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