The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

May. 09, 2023
Applicant:

Guangzhou Tyrafos Semiconductor Technologies Co., Ltd., Guangzhou, CN;

Inventors:

Ping-Hung Yin, Hsinchu, TW;

Jia-Shyang Wang, Miaoli County, TW;

Jia-Sian Lyu, Pingtung County, TW;

Shih-Chan Tai, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 25/10 (2023.01); G06T 3/4015 (2024.01); G06T 5/50 (2006.01); H01L 27/02 (2006.01); H01L 27/146 (2006.01); H04N 23/13 (2023.01); H04N 23/45 (2023.01); H04N 23/52 (2023.01); H04N 23/56 (2023.01); H04N 23/73 (2023.01); H04N 23/74 (2023.01); H04N 23/741 (2023.01); H04N 23/80 (2023.01); H04N 23/951 (2023.01); H04N 25/11 (2023.01); H04N 25/13 (2023.01); H04N 25/47 (2023.01); H04N 25/50 (2023.01); H04N 25/533 (2023.01); H04N 25/535 (2023.01); H04N 25/58 (2023.01); H04N 25/59 (2023.01); H04N 25/75 (2023.01); H04N 25/77 (2023.01); H04N 25/771 (2023.01); H04N 25/78 (2023.01);
U.S. Cl.
CPC ...
H04N 25/10 (2023.01); G06T 3/4015 (2013.01); G06T 5/50 (2013.01); H01L 27/0255 (2013.01); H01L 27/14605 (2013.01); H01L 27/14612 (2013.01); H01L 27/14643 (2013.01); H04N 23/13 (2023.01); H04N 23/45 (2023.01); H04N 23/52 (2023.01); H04N 23/56 (2023.01); H04N 23/73 (2023.01); H04N 23/74 (2023.01); H04N 23/741 (2023.01); H04N 23/815 (2023.01); H04N 23/951 (2023.01); H04N 25/11 (2023.01); H04N 25/134 (2023.01); H04N 25/135 (2023.01); H04N 25/47 (2023.01); H04N 25/50 (2023.01); H04N 25/533 (2023.01); H04N 25/535 (2023.01); H04N 25/58 (2023.01); H04N 25/59 (2023.01); H04N 25/75 (2023.01); H04N 25/77 (2023.01); H04N 25/771 (2023.01); H04N 25/78 (2023.01); G06T 2207/20208 (2013.01); G06T 2207/20221 (2013.01);
Abstract

The present invention relates to an image sensing device, including: an image sensing array, a conversion unit, and a processing circuit. The image sensing array is used to generate sensing signals of different periods. The conversion unit is used to convert the sensing signals from analog to digital. The processing circuit is used to generate a frame during an image capturing operation. The image sensing array includes a plurality of sensing sub-pixels, and the sensing sub-pixels have a sensing circuit and a storage circuit. The sensing circuit generates the sensing signals and sequentially stores the sensing signal in the storage circuit. The storage circuit sequentially outputs the sensing signals to the conversion unit.


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