The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Sep. 20, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyukjin Jung, Suwon-si, KR;

Jiwoo Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/02 (2006.01); G01S 19/32 (2010.01); H04B 1/00 (2006.01); H04W 4/029 (2018.01);
U.S. Cl.
CPC ...
H04M 1/026 (2013.01); G01S 19/32 (2013.01); H04B 1/0053 (2013.01); H04W 4/029 (2018.02);
Abstract

An electronic device according to an embodiment of the disclosure includes a housing that includes a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate and including a first conductive region and a second conductive region electrically separated from the first conductive region, a wireless communication circuitry that is disposed within the space, transmits/receives a first signal in a first frequency band ranging from 1.4 GHz to 6 GHz by using the first conductive region, and transmits/receives a second signal in a second frequency band ranging from 0.6 GHz to 1.4 GHz by using the second conductive region, and a GNSS receiver circuitry that is disposed within the space, receives a third signal in a third frequency band ranging from 1559 MHz to 1610 MHz by using the first conductive region, and receives a fourth signal in a fourth frequency band ranging from 1164 MHz to 1189 MHz by using the second conductive region. Moreover, various embodiment found through the present disclosure are possible.


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