The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Aug. 28, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Darryl G. Walker, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/04 (2006.01); G01K 1/14 (2021.01); G01K 3/00 (2006.01); G01K 7/01 (2006.01); G05F 3/26 (2006.01); G06F 1/08 (2006.01); G11C 11/402 (2006.01); G11C 11/406 (2006.01); G11C 11/419 (2006.01); H01L 23/34 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01); H03K 17/14 (2006.01);
U.S. Cl.
CPC ...
H03K 17/145 (2013.01); G01K 1/14 (2013.01); G01K 3/005 (2013.01); G01K 7/01 (2013.01); G05F 3/265 (2013.01); G06F 1/08 (2013.01); G11C 11/4026 (2013.01); G11C 11/40626 (2013.01); G11C 11/419 (2013.01); H01L 23/34 (2013.01); H01L 27/092 (2013.01); H01L 29/0665 (2013.01); H01L 29/42392 (2013.01); H01L 29/78696 (2013.01);
Abstract

An integrated circuit device having insulated gate field effect transistors (IGFETs) having a plurality of horizontally disposed channels that can be vertically aligned above a substrate with each channel being surrounded by a gate structure has been disclosed. The integrated circuit device may include a temperature sensor circuit and core circuitry. The temperature senor circuit may include at least one portion formed in a region other than the region that the IGFETs are formed as well as at least another portion formed in the region that the IGFETs having a plurality of horizontally disposed channels that can be vertically aligned above a substrate with each channel being surrounded by a gate structure are formed. By forming a portion of the temperature sensor circuit in regions below the IGFETs, an older process technology may be used and device size may be decreased and cost may be reduced.


Find Patent Forward Citations

Loading…