The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Dec. 09, 2021
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Mikiko Fukasawa, Nagaokakyo, JP;
Satoshi Goto, Nagaokakyo, JP;
Shunji Yoshimi, Nagaokakyo, JP;
Yuji Takematsu, Nagaokakyo, JP;
Mitsunori Samata, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2006.01); H01L 23/66 (2006.01); H03F 1/56 (2006.01);
U.S. Cl.
CPC ...
H03F 3/195 (2013.01); H01L 23/66 (2013.01); H03F 1/56 (2013.01); H01L 2223/6655 (2013.01); H03F 2200/451 (2013.01); H03F 2200/468 (2013.01);
Abstract
A second member is joined in surface contact with a first surface of a first member including a semiconductor region made from an elemental semiconductor. The second member includes a radio-frequency amplifier circuit made from a compound semiconductor. A conductive protrusion projects from the second member toward a side opposite to the first member. The first member includes a temperature measurement element that detects a temperature.