The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Jul. 08, 2022
Applicant:
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Inventors:
Shinya Hamano, Yokkaichi, JP;
Yoshikazu Sasaki, Yokkaichi, JP;
Junya Aichi, Yokkaichi, JP;
Jun Ikeda, Yokkaichi, JP;
Assignee:
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 5/04 (2006.01); H02G 3/16 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H02G 5/04 (2013.01); H02G 3/16 (2013.01); H05K 2201/09936 (2013.01);
Abstract
The present disclosure enables a cost reduction for a circuit assembly including electronic components. A circuit assembly includes: an electronic component; a conductive plate to which the electronic component is connected; and a holding member that holds the conductive plate. The conductive plate includes a mounting portion on which the electronic component is mounted, and a fiducial mark for positioning and mounting the electronic component. The fiducial mark is constituted by a hole formed in the conductive plate.