The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

May. 08, 2023
Applicant:

Molex, Llc, Lisle, IL (US);

Inventors:

Andrew Kolak, Villa Park, IL (US);

Dominic Steier, Naperville, IL (US);

Li Zhuang, Long Grove, IL (US);

Scott Sommers, Naperville, IL (US);

Hazelton P. Avery, Batavia, IL (US);

Pu Xie, Naperville, IL (US);

Chia Hung Mou, Taipei, TW;

Jerry Shubert, Batavia, IL (US);

Daniel Wenzel, Hoffman Estates, IL (US);

Assignee:

Molex, LLC, Lisle, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/6471 (2011.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 13/502 (2006.01); H01R 13/629 (2006.01); H01R 13/6583 (2011.01); H01R 13/6587 (2011.01); H01R 43/24 (2006.01); H01R 12/72 (2011.01); H01R 13/504 (2006.01); H01R 13/506 (2006.01); H01R 13/514 (2006.01); H01R 13/646 (2011.01); H01R 13/6461 (2011.01); H01R 13/658 (2011.01); H01R 13/6581 (2011.01); H01R 13/659 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6471 (2013.01); H01R 12/707 (2013.01); H01R 12/71 (2013.01); H01R 13/502 (2013.01); H01R 13/629 (2013.01); H01R 13/6583 (2013.01); H01R 13/6587 (2013.01); H01R 43/24 (2013.01); H01R 12/7011 (2013.01); H01R 12/7064 (2013.01); H01R 12/72 (2013.01); H01R 12/721 (2013.01); H01R 12/727 (2013.01); H01R 13/504 (2013.01); H01R 13/506 (2013.01); H01R 13/514 (2013.01); H01R 13/646 (2013.01); H01R 13/6461 (2013.01); H01R 13/658 (2013.01); H01R 13/6581 (2013.01); H01R 13/659 (2013.01);
Abstract

Examples of connectors, connector assemblies, and wafer assemblies for improved shielding and thermal performance are described. In one example, a wafer assembly includes a ground path assembly and a row of conductors. The ground path assembly includes a first ground shield and a second ground shield. The row of conductors includes a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors. The first ground shield extends along a first pair of communication signal conductors among the plurality of communication signal conductors and the second ground shield extends along a second pair of the communication signal conductors among the plurality of communication signal conductors.


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