The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Dec. 18, 2020
Applicant:

Foshan Nationstar Optoelectronics Co., Ltd., Foshan, CN;

Inventors:

Kuai Qin, Foshan, CN;

Heng Guo, Foshan, CN;

Kailiang Fan, Foshan, CN;

Caineng Huo, Foshan, CN;

Zhuang Peng, Foshan, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/544 (2006.01); H01L 25/075 (2006.01); H01L 33/32 (2010.01); H01L 33/44 (2010.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 23/544 (2013.01); H01L 25/0753 (2013.01); H01L 33/32 (2013.01); H01L 33/44 (2013.01); H01L 33/46 (2013.01); H01L 33/502 (2013.01); H01L 2223/54406 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step Sand step S. In step S, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.


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