The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Mar. 10, 2021
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xinhong Lu, Beijing, CN;

Zhanfeng Cao, Beijing, CN;

Jingshang Zhou, Beijing, CN;

Liuqing Li, Beijing, CN;

Ting Zeng, Beijing, CN;

Yongfei Li, Beijing, CN;

Qi Qi, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d, a thickness of the flexible substrate is d, and d≥2 μm and |d−d|≤3 μm.


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