The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Mar. 30, 2022
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Akira Hori, Tokushima, JP;

Tomokazu Maruyama, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 33/505 (2013.01); H01L 33/508 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A method of manufacturing a light emitting device including: providing an intermediate structure including an light emitting element and a support body; securing a plate-shaped intermediate resin member and the light emitting element with a light-transmissive member such that the intermediate resin member includes first resin extended portions extending outwardly in the first direction respectively from both short sides of the light emitting element in a plan view; cutting the intermediate resin member at cutting positions along the second direction to obtain a resin member with a concave lower surface, a maximum distance from the light emitting element to a respective one of the cutting positions in the first direction being longer than a maximum length of the light emitting element in the second direction; and forming a covering member to cover lateral surfaces of the resin member such that an upper surface of the resin member is exposed.


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