The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Dec. 13, 2021
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jingyi Feng, Beijing, CN;

Yingsong Xu, Beijing, CN;

Changlong Yuan, Beijing, CN;

Zhenhua Zhang, Beijing, CN;

Xilei Cao, Beijing, CN;

Qian Ma, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G02F 1/1333 (2006.01); G02F 1/1362 (2006.01); G02F 1/16756 (2019.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/133345 (2013.01); G02F 1/136227 (2013.01); G02F 1/16756 (2019.01); H01L 27/1262 (2013.01); G02F 2201/42 (2013.01);
Abstract

A display substrate, a display device, a method of forming a display substrate, and a method of forming a display device are provided. The display substrate includes: a first insulation structure, including a display area and a frame area, where the frame area is arranged around the display area, and at least one first groove is arranged in the first insulation structure of the display area; a first wiring layer arranged on the first insulating structure and covering a side surface and a bottom surface of the first groove; a second insulation structure arranged on the first wiring layer, where at least one first through-hole is formed in the second insulation structure of the frame area; a first conductive structure covering a part of an upper surface of the second insulating structure and at least a sidewall and a bottom surface of the first via-hole.


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